Yole: Reshaping the IGBT supply chain, China is developing rapidly
"Driven by electric vehicles, IGBT is growing rapidly, and the supply chain is also adjusting its strategy and making large-scale investments", Yole Développement (Yole) power electronics and compound semiconductor technology and market analyst Dr. Ana Villamor asserted.
She added: "IGBT is the key to many power electronic applications. With the vigorous promotion of EV/HEV popularization, Yole expects that between 2020 and 2026, the compound annual growth rate of IGBT will be 7.5%, and it will reach 8.4 billion US dollars by then. Driven by the popularization of EV/HEV, the IGBT module market segment will account for 81% of the total market in the same period of 2026.
"In addition to EV/HEV, discrete IGBT and IGBT power modules can also be found in applications such as industrial motor drives, wind turbines, photovoltaic installations, trains, UPS, EV charging infrastructure, and household appliances.
According to Yole's report, in 2020, the largest market segments for IGBTs are industrial applications and household appliances. It is followed by EV/HEV, which will have a market size of USD 509 million in 2020 and will grow at an astonishing 23% compound annual growth rate between 2020 and 2026. This is because the automotive market is shifting from ICE to EV/HEV, which is strongly promoted by the government's CO2 emission reduction targets. This transformation is accelerating further.
In Yole's view, at the system level, the new IGBT voltage levels cover new voltage ranges: for example, EV inverters moved from 400V to 800V, and PV inverters moved to 1,500V. Analysts have also seen many technological innovations: a new generation of IGBT chips, higher efficiency, and lower IGBT device costs; IGBT packaging is also seeking high-reliability, low-cost, and low-inductance electrical interconnections. At the same time, IGBT is advancing the development of SiC packaging; at the wafer level, analysts have seen the 300mm IGBT wafer manufacturing trend and the shift to MCZ silicon materials.
Therefore, Abdoulaye Ly, Yole Electronic Power System Technology and Market Analyst, explained: “The charging infrastructure is also affected by government decisions, because the deployment of chargers is critical to expanding the popularity of electric vehicles.” “Although the charging infrastructure is important to IGBT It is still a small market, but it is expected to grow by more than 300% in the next five years."
According to Yole, the main manufacturers of IGBTs are all over the world, and the big players in history are in Europe, the United States and Japan.
Among them, the largest IGBT manufacturers include Infineon Technology, Littelfuse, Fuji Electric... They all provide discrete IGBT and IGBT power modules. Large-scale IDMs vertically integrated into the system basically provide IGBT modules. It includes Danfoss, Mitsubishi Electric, CRRC, etc.... Most companies whose products are positioned in the lower voltage range also provide discrete IGBTs.
In order to target the largest IGBT market, all manufacturers provide 600V – 1,200V components, as well as a series of new products (from 800 to 1,000V). Some manufacturers, including Mitsubishi Electric, Toshiba and ON Semiconductor, are seeking to differentiate from their competitors by offering IGBT devices with "middle" nominal voltage levels (for example, 1,300V, 1,350V, 2,000V).
Yole's analysts deeply analyzed the IGBT supply chain and its evolution. Even though Top3 has not changed much since the last report, the IGBT supply chain is also developing strongly. The goal is obviously to respond to market evolution, especially to promote the EV/HEV market segment. They pointed out that many IGBT manufacturers are vertically integrated, especially in device manufacturing and packaging. The rapidly growing demand for IGBTs is driving mergers and acquisitions. The entire supply chain is being reshaped, especially as participants are trying to find the best position in the market.
"Infineon, Fuji Electric, Mitsubishi Electric, Hitachi, ON Semiconductor, and Toshiba have been engaged in the IGBT business for many years, and many products have been commercialized," commented Milan Rosina, Yole's principal analyst, adding: "However, it is important What is important is to pay attention to the growth of Chinese IGBT manufacturers, who are catching up quickly in terms of development, production and production capacity."
In addition, due to the relatively sufficient capacity of 200mm wafer fabs for power devices, 300mm wafer manufacturing can achieve higher device production capacity to meet the growing IGBT market demand. Not surprisingly, in order to increase production in the next 10 years, all major players are investing in IGBT manufacturing capacity expansion, as the transition to 300mm wafers enables a better cost structure to cope with the increasing competition with Chinese manufacturers. However, several Chinese manufacturers, such as Hua Hong Hongli and CanSemi, have expanded to 300mm by expanding their factories or acquiring foreign companies.
The rise of the domestic IGBT army
IGBT is a basic product related to the country's economic development. For such an important IGBT, my country has had to face the embarrassing situation of relying on imports for a long time. The market is mainly monopolized by international giants led by Infineon, Mitsubishi and Fuji Electric. Since 2005, a large number of overseas IGBT talents have returned to China to invest in the development of the domestic IGBT chip and module industry, especially the United States International Rectifier Company (IR) who has returned to China.
The experts who returned from IR mainly engaged in chip development include Dr. Tang Yi from Star Semiconductor, Dr. Zhiyong Chen from Daxin Semiconductor, Dr. Jie Zhang from Luxin Technology, etc. The above companies have become product companies mainly producing IGBT chips. In addition, the IR returning expert to engage in module development is Dr. Weidong Zhuang of Yinmao Microelectronics. The Institute of Microelectronics of the Chinese Academy of Sciences set foot in the IGBT industry earlier, and Wuxi Zhongke Junxin was mainly responsible for IGBT research and development. The research and development team of Zhongke Junxin has successively joined the technical teams of Microelectronics, IR, Denso, and Chengdian.
As a leading company in the domestic IGBT industry, Star Semiconductor was established in 2005 and successfully listed on the main board of the Shanghai Stock Exchange on February 4, 2020. The IGBT chip and fast recovery diode chip independently developed and designed by the company are one of the company's core competitiveness. According to IHSMarkit report data, in the global market share ranking of IGBT module suppliers in 2018, Star Semiconductor ranked 8th, ranked 1st among Chinese companies, and became the only Chinese company among the top ten in the world. Among them, the second-generation chip (the international sixth-generation chip FS-Trench) independently developed by Star Semiconductor has achieved mass production, successfully breaking the perennial monopoly of foreign companies on IGBT chips.
Established in 2013, Ningbo Daxin is mainly engaged in the design, manufacturing and sales of power semiconductor chips and devices such as IGBT, MOSFET, FRD and so on. The company has successfully developed 600V-3300V IGBT chip products on 8-inch and 6-inch wafer manufacturing platforms, with chip current levels ranging from 10A to 200A. Adopting independent IGBT chips, Daxin has launched a series of IGBT modules that meet industrial applications, consumer electronics, and new energy. The module voltage covers 600V to 1700V, and the current level covers 10A to 800A.
Shanghai Luxin Electronic Technology focuses on the design and application of power semiconductors (IGBT, SJMOS & SiC), including chips, monotubes and modules. It has the following advantages: by optimizing the withstand voltage terminal ring, achieving high blocking voltage of IGBT, effectively reducing the chip area, and reaching industrial-grade and automotive-grade reliability standards; optimizing saturation voltage drop and switching speed by controlling the minority carrier life; realizing safe operating area (SOA) and short-circuit current safe operation area SCSOA performance is the best; improve the reliability of IGBT active area cell design and suppress the latch-up effect of IGBT; adjust backside thinning, injection, annealing, back gold and other processes; achieve 60um~180um Mass production of wafer thickness.
Nanjing Yinmao Microelectronics (SilverMicro) was established in 2007, focusing on the design and manufacturing of power IGBT and MOSFET modules for industrial and other applications. By using modern equipment to process and characterize power modules up to 3.3kV, Nanjing Yinmao Microelectronics has established advanced power module manufacturing capabilities and can also perform power module qualification tests. Products have been widely used in industrial inverters, welding machines, UPS, power supplies and new energy applications.
Jiangsu Zhongke Junxin Technology Co., Ltd. is a Sino-foreign high-tech joint venture focusing on the research and development of new power electronic chips such as IGBT and FRD. It was established at the end of 2011. Junxin Technology is the first domestic enterprise to develop Trench FS technology and realize mass production. The company's IGBT chip, single tube and module products range from 600V to 6500V, covering the current main voltage and current segments, and have been used in batches of induction heating, inverter welding machines, industrial frequency conversion, new energy and other fields. Junxin Technology’s original DCS technology will be applied to the latest automotive-grade IGBT chips.
With the gradual improvement of the industry's prosperity and the promotion of policies, many new entrants are also vying for the market. According to TrendForce’s analysis, there are currently three main types of new entrants in the market. One is power semiconductor companies that expand their business to high-end products such as IGBTs, such as Yangjie Technology, China Microelectronics, etc.; the other is to meet their own needs and supply Chain security considers to venture upstream, such as CRRC Times and BYD; third, new companies that are optimistic about the market and enter the market, such as Ruineng Semiconductor, Guangdong Xinjuneng, and Funeng Semiconductor.
In terms of IGBT, Yangjie Technology held a 6-inch wafer line in Yixing in March 2018. At present, the production line has mass-produced IGBT chips, which are mainly used in small home appliances such as induction cookers. In addition, Yangjie Technology is also actively promoting the development of new IGBT module products. The 50A/75A/100A-1200V half-bridge specification IGBT has been successfully developed. In addition, the company is also actively planning the construction of the 8-inch line, and reserves 8-inch line wafers and IGBT technical talents.
Jilin China Microelectronics, a veteran power semiconductor device manufacturer, issued a share allotment specification in April 2019, and plans to raise funds for the construction of an 8-inch production line project. The main products of the fundraising project are technologically advanced, reaching the level of manufacturers such as Infineon and ABB. China Microelectronics went public in 2001 and was the first listed company in the field of power semiconductor devices in China. At present, a series of products with IGBT, MOSFET, SCR, SBD, IPM, FRD, BJT, etc. as the main marketing line have been formed, and the product categories basically cover the entire range of power semiconductor devices. The company's IGBT chip technology, Trench technology, life control and terminal design technology are domestically advanced, reaching the international advanced level in the same industry.
Among IDM model manufacturers, CRRC and BYD have achieved certain results by relying on high-speed rail and new energy vehicles respectively.
Zhuzhou CRRC Times Semiconductor Co., Ltd. (abbreviated as: CRRC Times Semiconductor), as a wholly-owned subsidiary of CRRC Times Electric Co., Ltd., is fully responsible for the company's semiconductor industry operations. Since 1964, it has invested in the R&D and industrialization of power semiconductor technology. In 2008, it strategically acquired British Dannicks. Now it has become one of the few international IDMs (integrated design Manufacturing) model enterprise representatives, with a complete industrial chain of chip-module-device-system.
CRRC Times Semiconductor has the first 8-inch IGBT chip line in China and the second in the world. The full range of high-reliability IGBT products has fully solved the situation that core components of rail transit are controlled by others, and basically solved the problem of localization of key components of UHV power transmission projects. , And is solving the problem of autonomy of the core components of my country's new energy vehicles.
BYD entered the IGBT industry in 2005 and launched the first automotive-grade IGBT 1.0 technology in 2009, breaking the monopoly of international manufacturers and achieving a zero breakthrough in automotive IGBT chip technology in my country. In 2018, its IGBT 4.0 products surpassed those of mainstream companies such as Infineon in many key indicators such as current output, comprehensive loss and temperature cycle life, and the production capacity has reached 50,000 pieces, and has achieved external supply. The company is also the only car company in China that has a complete IGBT industrial chain, including IGBT chip design, wafer manufacturing, module packaging, etc., as well as simulation testing and vehicle testing. The good news is that, according to a recent report by the Changsha Evening News, the Changsha BYD IGBT project has officially started construction a few days ago, and it is planned to build an integrated circuit manufacturing production line.
Among the new IGBT players, Chengdu Senwei Technology Co., Ltd., in which Zhenhua Technology has a 20% stake, is a high-tech enterprise founded by a team of doctors from Tsinghua University and the Chinese Academy of Sciences. The company was established in 2017 and is mainly engaged in power semiconductor chips such as IGBTs and Product design, development and sales. Moriway Technology's IGBT chip product performance can be compared to Infineon products. The company's main product voltage level is 600V-1700V, and the current specification of a single chip is 5A-200A, covering industrial control, variable frequency home appliances, electric vehicles, wind power servo drives, photovoltaic inverters and other fields.
It is understood that Ruineng Semiconductor, which is born in NXP's power product line, also intends to enter the IGBT track. In fact, Ruineng also has the advantage of making IGBTs. First of all, Ruineng is a supplier of all important white goods manufacturers. It has a deep understanding of market applications and customer needs. The products will have advantages in cost performance in the future; Energy is also the only Chinese power semiconductor company with a global distribution network in China. Finally, Reinergy has more than 50 years of power device technology accumulation, and IGBT is the most reliable. Relying on Reineng’s Nanchang National Reliability and Failure Analysis Laboratory, it will be Form a competitive advantage in quality and reliability.
Guangdong Xinjuneng Semiconductor, established in November 2018, also values the IGBT market. Xinjuneng Semiconductor held a groundbreaking ceremony in Nansha, Guangzhou on September 20, 2019, with a total project investment of 2.5 billion yuan. It is understood that the first phase of its project will build a production base for IGBT and SiC power devices and modules for new energy vehicles, while achieving large-scale production of industrial-grade power devices. In the second phase, automotive power modules, semiconductor devices and system products for new energy vehicles and autonomous driving will be extended and formed from chips to packages and modules.
In addition to the companies mentioned above, domestic IGBTs basically have a layout in the entire industrial chain of chip design, wafer manufacturing, and module packaging. On the whole, China's IGBT industry chain is gradually becoming capable of domestic substitution.
Sorting out the entire domestic IGBT industrial chain (table making: observation of the semiconductor industry)
The IGBT industry chain is still insufficient, and the gap with foreign countries is obvious
At present, China's IGBT industry has been able to have a certain industrial chain synergy, but domestic IGBT technology is currently in its infancy in chip design, wafer manufacturing, and module packaging. Wafer manufacturing, backplane thinning and packaging technology are the main difficulties of IGBT manufacturing technology. In these aspects, we have a clear gap with foreign companies.
At present, the biggest problem facing the development of IGBT is the lack of upstream technology and capacity support for IGBTs, and the low level of trust in domestic IGBTs in the downstream. Moreover, the scale of domestic IGBT companies is relatively small and investment is insufficient.
IGBT practitioners said that the current domestic IGBT is mainly restricted by the bottleneck of wafer production. First, there is no professional foundry for IGBT foundry. The original 8-inch trench IGBT products are mainly manufactured by Huahong, but IGBT is not the mainstay of Huahong. For operating business, product quotas are extremely scarce, and prices are high. However, with the completion of SMIC’s Shaoxing plant and Qingdao Xinen Semiconductor’s fab, I believe this situation will be greatly changed.
Secondly, compared with foreign manufacturers, domestic companies still lag behind the global leaders in large-size wafer manufacturers. The larger the wafer, the more chips can be produced on a single wafer. Under the same manufacturing and processing conditions, The manufacturing cost of the unit chip will be lower. At present, the most competitive production lines for IGBT products are 8-inch and 12-inch, and the leading manufacturer is Infineon. The vast majority of domestic wafer manufacturers were still at the stage of 6-inch products. At present, domestic mass production of 8-inch products includes BYD, CRRC, Shanghai Advanced, Huahong Grace, Silan Micro, and Silan Micro's 12-inch wafer production line is expected to be mass-produced by the end of 2020.
IGBT has high technical requirements for the backside process and thinning process. Among them, the annealing activation in the backside process is extremely difficult; in the thinning process, my country is still relatively backward. At present, it is generally possible to thin the wafer to 175μm in China. In December 2018, BYD announced that it can thin the wafer to 120μm. The IGBT chip manufactured by Infineon can be thinned down to 40um. In the horizontal comparison of production lines of the same size, there is still a certain gap in the yield rate of domestic wafer production lines compared with international leaders.
In addition to wafer production, there are also restrictions on packaging. The heat dissipation efficiency requirements of automotive IGBTs are much higher than those of industrial grades. The temperature inside the inverter can reach up to 120°C, and strong vibration conditions must also be considered. Therefore, the packaging requirements are much higher than the industrial level. The main purpose of IGBT packaging is heat dissipation, and the key is the material. In terms of IGBT packaging materials, Japan is far ahead in the world, Germany and the United States are following the trend, while my country's material science is relatively backward.
Therefore, it can be seen that IGBT is a company that is extremely dependent on the details of the production line. Taking Infineon’s own report as an example, the performance difference of the products produced on the 6-inch and 8-inch wafer production lines with the same design Great, the products produced on the same two 8-inch wafer production lines also differ greatly in performance. This means that the design company cannot stand alone beyond the support of the foundry. Therefore, the best route is IDM, which is also the only way for IGBT companies to become large and strong.
*Disclaimer: This article is original by the author. The content of the article is the author's personal opinion. The reprint of Semiconductor Industry Observation is only to convey a different point of view. It does not mean that Semiconductor Industry Observation agrees or supports this view. If you have any objections, please contact Semiconductor Industry Observation.
